Using our advanced technical skills, all sputtering target-manufacturing processes (material processing, forming, burning, processing, and bonding) are carried out via integrated production. This makes the distribution of high quality and stability sputtering targets possible. Also, with the development of our company's original large bonding equipment, we are capable of producing targets with a maximum size of 3.8m x 0.5m. Furthermore, we provide customer-orientated technical support including: film evaluation, film deposition and arcing (abnormal electric discharge) prevention technologies. Also, through the design and production of our original sputter film deposition machines (cathode, power source, and others), we offer solid technical skills that satisfy our customer's needs.

What is sputtering? By placing the sputtering target and board opposite to each other in a vacuum chamber and by increasing the voltage, the introduced gases such as argon becomes plasmic. During this process, the ions generated are accelerated by electric fields and hit the target. The target components rush out and stick to the board opposite to the target. Sputtering is a method that by using this principle creates thin films on the board ranging from angstrom units to micron orders.